PacTech GmbH, one of the leading companies within the microelectronics industry that specializes in Wafer Level Packaging services and automated bonder for high throughput laser soldering in solar manufacturing and with more than 250 employees worldwide, is excited to welcome Mr. Heinrich Lüdeke as the new President & CEO as of September 1, 2013.
Dr. Elke Zakel, previous President & CEO and co-founder of PacTech, left the company at the end of August 2013 after almost 18 years of leading the company to devote more time to new initiatives. She will continue to assist PacTech as Technical and Scientific Advisor.
Mr. Lüdeke assumed all areas of responsibility that so far were assigned to Dr. Zakel.
The acquisition of further shares was the main reason for changing PacTech’s management. With 97,22% Nagase & Co.,Ltd. is now major shareholder of PacTech GmbH.
Mr. Lüdeke as long-time General Manager of Nagase Europa GmbH played a major role in establishing and growing the collaboration between PacTech and Nagase. Through his continuous support, he has paved the way for attracting Nagase as PacTech’s shareholder in February 2006.
The electrical engineer, married and two children, will furthermore lead the Pac Tech GmbH and its subsidiaries in Malaysia and the USA from the headquarters in Nauen, Germany.
Besides diversifying and expanding PacTech's existing business segments, Mr. Lüdeke will rely on an even closer collaboration with the Japanese parent company Nagase.